Method to Determine Maximum Allowable Sinterable Silver Interconnect Size
A. A. Wereszczak, M. C. Modugno, S. B. Waters, D. J. DeVoto, and P. P. Paret
Additional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT)
May 2016, Vol. 2016, No. HiTEC, pp. 000207-000215
- DOI:
http://dx.doi.org/10.4071/2016-HITEC-207