Study on the Performance of a Novel Mixed-Particle Silver Paste Sintered at 180 °C
Zhiwei Wang; Xin Li
IEEE Transactions on Components, Packaging and Manufacturing Technology
Volume: 13, Issue: 9, September 2023
- DOI:
http://dx.doi.org/10.1109/TCPMT.2023.3313153
Weishan Lv, Jianxiong Hu, Jiaxin Liu, Chuanguo Xiong, Fulong Zhu
Nanotechnology
Volume 34, Number 16, P 165701
Citation Weishan Lv et al 2023 Nanotechnology 34 165701
- DOI:
http://dx.doi.org/10.1088/1361-6528/acb4f3