Highly Conductive Copper–Silver Bimodal Paste for Low-Cost Printed Electronics
Amin Zareei, Sarath Gopalakrishnan, Zeynep Mutlu, Zihao He, Samuel Peana, Haiyan Wang, Rahim Rahimi
ACS Appl. Electron. Mater. 2021, 3, 8, 3352–3364
- DOI:
http://dx.doi.org/10.1021/acsaelm.1c00345