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Effect of flake silver-plated copper particles on the property enhancement of electrically conductive adhesives†
Na Cheng, Zhi Sun, Xiaohui Yu, Qianzhen Yua, Jianwei Zhao
Phys. Chem. Chem. Phys.
2023, 25, 10022-10032

DOI:

http://dx.doi.org/10.1039/D3CP00209H

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