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Preparation of silver-coated copper powders and its application in conductive adhesives
Weiwei Zhang; Hongtao Chen; Jianqiang Wang; Luobin Zhang; Jintao Wang et al.
IEEE Xplore
Date of Conference: 10-13 August 2022
Date Added to IEEE Xplore: 09 September 2022

DOI:

http://dx.doi.org/10.1109/ICEPT56209.2022.9873217

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