AIP
1. Journal of Vacuum Science and Technology B, Volume 15, Issue 5, pp. 1780-1787 (September 1997)
Study of the copper reflow process using the GROFILMS simulator
L. J. Friedrich, D. S. Gardner, S. K. Dew, M. J. Brett, and T. Smy
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http://dx.doi.org/10.1116/1.5895252. Journal of Physics: Condensed Matter, 2009, v21, №22, 224014 (11pp)
Ion beam sputtering nanopatterning of thin metal films: the synergism of kinetic self-organization and coarsening
M Stepanova and S K Dew
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http://dx.doi.org/10.1088/0953-8984/21/22/224014Simulating discrete models of pattern formation by ion beam sputtering
Alexander K Hartmann, Reiner Kree and Taha Yasseri
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http://dx.doi.org/10.1088/0953-8984/21/22/224015Kinetic Monte Carlo simulations compared with continuum models and experimental properties of pattern formation during ion beam sputtering
E Chason and W L Chan
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http://dx.doi.org/10.1088/0953-8984/21/22/2240165. Physical Review B: Condensed Matter, 56, 15157 - 15166 (1997)
Surface diffusion mechanism for step bunching
Mats I. Larsson
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http://dx.doi.org/10.1103/PhysRevB.56.15157Kinetic Monte Carlo simulations of adatom island decay on Cu(111)
Mats I. Larsson
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http://dx.doi.org/10.1103/PhysRevB.64.115428Sputtering from ion-beam-roughened Cu surfaces
M. Stepanova and S. K. Dew
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http://dx.doi.org/10.1103/PhysRevB.66.125407