+++ Electrochem. Solid-State Lett.

[Tolstopuz]

Уважаемые коллеги, попогите со статьей:

Chien-Neng Liao, Ching-Hua Lee, and Wen-Jin Chen.
Effect of Interfacial Compound Formation on Contact Resistivity of Soldered Junctions Between Bismuth Telluride-Based Thermoelements and Copper.

Electrochem. Solid-State Lett., Volume 10, Issue 9, pp. P23-P25 (2007)

DOI:

http://dx.doi.org/10.1149/1.2749330

Спасибо!

[kms]

1.zip

[Tolstopuz]

Спасибо, kms!!!
Опертивно, однако.