Journal of Applied Polymer Science
Volume 74, Issue 14, pages 3396–3403, 27 December 1999
Thermal conductivity, elastic modulus, and coefficient of thermal expansion of polymer composites filled with ceramic particles for electronic packaging
C. P. Wong, Raja S. Bollampally
- DOI:
http://dx.doi.org/10.1002/(SICI)1097-4628(19991227)74:14<3396::AID-APP13>3.0.CO;2-3
