+++ Springer – 3 JEM/JMS +++ Большое спасибо, FIN =)

[tsarapoid]

Большая просьба скачать тройку статей =)

Low-Temperature Bonding Process by Silver Nanoparticles Paste for Power Electronic Devices
Yu-Chi Fang, Yu-Chieh Wang, Fan-Yi Ouyang
Journal of Electronic Materials
Volume 52, pages 792–800, (2023)

DOI:

http://dx.doi.org/10.1007/s11664-022-10118-7

Bonding Below 150°C Using Nano-Ag Film for Power Electronics Packaging
Zhongyang Deng, Guisheng Zou, Hongqiang Zhang, Qiang Jia, Wengan Wang, Ying Wu, A. Zhanwen, Bin Feng & Lei Liu
Journal of Electronic Materials
Volume 52, pages 3903–3913, (2023)

DOI:

http://dx.doi.org/10.1007/s11664-023-10358-1

Evaluating electrochemical migration behavior of sintered nano-Ag: factors of bias voltage, electrode spacing, sinter process parameters, and NaCl concentration
Yongzhe Xu, Yang Liu, Zhen Pan, Ke Li, Jicun Lu & Quan Sun
Journal of Materials Science: Materials in Electronics
Volume 34, 1971, (2023)

DOI:

http://dx.doi.org/10.1007/s10854-023-11369-8

[FIN1]