Low Temperature Sintered Silver Nanoflake Paste for Power Device Packaging and Its Anisotropic Sintering Mechanism
Chuncheng Wang, Gang Li*, Liang Xu, Junjie Li, Dailin Zhang, Tao Zhao, Rong Sun, and Pengli Zhu*
ACS Appl. Electron. Mater. 2021, 3, 12, 5365–5373
- DOI:
http://dx.doi.org/10.1021/acsaelm.1c00857