+++ FIN1 спасибо большое +++ 4 статьи Elsevier / ScienceDirect +++

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Preparation and characterization of nano-solder paste with high nanoparticle loading and their thermal and printing properties
Evan Wernicki, Yang Shu, Edward Fratto, Fan Gao, Gregory Morose, Brendan Lucas, Zhengyang Yang, Zhiyong Gu
Materials Chemistry and Physics
Volume 297, 1 March 2023, 127399

DOI:

http://dx.doi.org/10.1016/j.matchemphys.2023.127399

Thermal creep and fatigue failure of the sintered silver solder in a SiC-IGBT module under power cycling
Xiaoguang Huang, Yichao Wang, Qihui Zhu, Zhongzhe Du, Longchi Zhou, Hehe Liu
Engineering Failure Analysis
Volume 154, December 2023, 107625

DOI:

http://dx.doi.org/10.1016/j.engfailanal.2023.107625

Improvement of solder interconnections applied on back contact solar cells with low-temperature copper paste busbars
Dominik Rudolph, Tobias Messmer, Tudor Timofte, Ning Chen, Joris Libal, Florian Buchholz, Isaac Rosen
Solar Energy Materials and Solar Cells
Volume 264, January 2024, 112603

DOI:

http://dx.doi.org/10.1016/j.solmat.2023.112603

Effect of surfactants on the chemical preparation of tin-silver-copper nanoparticles
Zhenxiang Liu, Kaijun Wang, Kaizhao Wang, Huaming Deng, Weijun Zhang, Jin Hu
Journal of Alloys and Compounds
Volume 968, 15 December 2023, 172311

DOI:

http://dx.doi.org/10.1016/j.jallcom.2023.172311

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