Microstructural analysis and thermal conductivity of the Ag–Bi–Sn alloys
Dragan Manasijević, Ljubiša Balanović, Ivana Marković, Milan Gorgievski, Uroš Stamenković, Kristina Božinović, Duško Minić, Milena Premović
Thermochimica Acta, Volume 717, 179344
- DOI:
http://dx.doi.org/10.1016/j.tca.2022.179344
Jingchao Jiang, Xiaoya Zhai, Kang Zhang, Liuchao Jin, Qitao Lu, Zhichao Shen, Wei-Hsin Liao
Additive Manufacturing, Volume 72, 103633
- DOI:
http://dx.doi.org/10.1016/j.addma.2023.103633
Wettability and Reaction between Solder and Silver Busbar during the Tabbing Process for Silicon Photovoltaic Modules
Beom-Yong Lee, Thi-Lien Hoang, Sung-Bin Cho, Joo-Youl Huh, Young-Sik Lee
Japanese Journal of Applied Physics, 2012, Volume 51, Number 10S
- DOI:
http://dx.doi.org/10.1143/JJAP.51.10NA12